Aerospace & Automotive
The increased use of composites and organic polymer resins in the transportation industry presents significant advantages in terms of increased fuel savings and vehicle durability (i.e. anti-corrosion, increased strength). As a culture, we have grown dependent on car and air travel despite their harmful air emissions. Nearly 20 lbs of CO2 is created for every gallon of gas that is burned to power an average car. Airplanes also consume large amounts of fuel with efficiencies (~70MPG/seat) that are, on average, less than half that of conventional automobiles (~140 MGP/seat) and much lower than busses and trains (~500MPG/seat). Unfortunately, there are no viable non-fossil fuel solutions for airplanes so that efficiency gains must come from weight loss and improved design. PolyDrop accelerates adoption of lightweight materials by solving their electrical conductivity issues. Our DiStat formulations could be incorporated into epoxy primers and/or polyurethane topcoats by providing ESD along withhigh transmission, low haze, and good durability.
The growing use of electronics in many markets is driving increased demand for ESD protection during electronics production, packaging, shipment and use. Because of miniaturization, electronics are increasingly sensitive to particulate contamination and must be protected from lower levels of static charge. Conductive polymers in trays, conveyor belts, and cases for electronic circuit production prevent static discharge that could destroy sensitive circuits. Even in packaging of electronics, more reliable ESD protection offered by permanent DiStat products is desired to protect the relatively expensive packaged product during shipping and handling.
Antistatic, electrostatic dissipative (ESD) and conductive DiStat additives are used in plastics compounds in many applications, from packaging to automotive. Excellent optical properties and good durability make DiStat products the perfect choice for plastics master batches. DiStat products can be coated or directly incorporated into many plastics, including polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polyamide (PA), and polypropylene (PP).
Industrial packaging is a new growth market for ESD additives, as traditional packaging like paper and metal continues to be replaced with plastic. Flexible intermediate bulkcontainers and flexible packaging must be protected from static discharge, because a spark could lead to fire or dust explosion. DiStat products offer high transmission and great durability over existing solutions.
Three-dimensional printed plastic electronic components are the future of the electronics manufacturing. While metal or carbon black components are difficult to incorporate in 3D printing conductive polymers is the best choice for designing flexible and structural components. DiStat powders can be used inPLA, ABS, PVA, Nylons, PC, PEI, PTFE and other polymers used in 3D printing.